JPH0735414Y2 - 電子部品搭載用多層回路基板 - Google Patents
電子部品搭載用多層回路基板Info
- Publication number
- JPH0735414Y2 JPH0735414Y2 JP1989100948U JP10094889U JPH0735414Y2 JP H0735414 Y2 JPH0735414 Y2 JP H0735414Y2 JP 1989100948 U JP1989100948 U JP 1989100948U JP 10094889 U JP10094889 U JP 10094889U JP H0735414 Y2 JPH0735414 Y2 JP H0735414Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- prepreg
- annular spacer
- layer
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 125000006850 spacer group Chemical group 0.000 claims description 35
- 239000010410 layer Substances 0.000 claims description 21
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 19
- 239000011347 resin Substances 0.000 description 18
- 229920005989 resin Polymers 0.000 description 18
- 239000007788 liquid Substances 0.000 description 12
- 239000011148 porous material Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000007788 roughening Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010615 ring circuit Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989100948U JPH0735414Y2 (ja) | 1989-08-29 | 1989-08-29 | 電子部品搭載用多層回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989100948U JPH0735414Y2 (ja) | 1989-08-29 | 1989-08-29 | 電子部品搭載用多層回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0339878U JPH0339878U (en]) | 1991-04-17 |
| JPH0735414Y2 true JPH0735414Y2 (ja) | 1995-08-09 |
Family
ID=31649925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989100948U Expired - Lifetime JPH0735414Y2 (ja) | 1989-08-29 | 1989-08-29 | 電子部品搭載用多層回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0735414Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014125894A1 (ja) * | 2013-02-15 | 2014-08-21 | 株式会社村田製作所 | 積層回路基板 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006179733A (ja) * | 2004-12-24 | 2006-07-06 | Casio Comput Co Ltd | 多層配線基板およびその製造方法 |
| KR101297482B1 (ko) * | 2013-05-08 | 2013-08-16 | 이흥재 | 천정 빨래 건조대 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0722224B2 (ja) * | 1986-09-26 | 1995-03-08 | 三菱瓦斯化学株式会社 | Ｉｃチツプ搭載用多層板の製造法 |
| JPH0722225B2 (ja) * | 1986-09-26 | 1995-03-08 | 三菱瓦斯化学株式会社 | Ｉｃチツプ搭載用多層板の製造法 |
-
1989
- 1989-08-29 JP JP1989100948U patent/JPH0735414Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014125894A1 (ja) * | 2013-02-15 | 2014-08-21 | 株式会社村田製作所 | 積層回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0339878U (en]) | 1991-04-17 |
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